Apparatus and methods for conditioning a polishing pad

ABSTRACT

Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the polishing pad with a linearly variable amount of force. A first force is produced with the actuator. The first force is scaled by a linearly variable amount to a second force that is applied to the polishing pad by a conditioning disk. Numerous other aspects are disclosed.

This application is a division of, and claims priority to, U.S.Non-Provisional patent application Ser. No. 11/684,969, filed Mar. 12,2007, and titled, “APPARATUS AND METHODS FOR CONDITIONING A POLISHINGPAD” (Attorney Docket No. 10445), which claims priority to U.S.Provisional Patent Application Ser. No. 60/782,133, filed Mar. 13, 2006,and titled, “APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD”(Attorney Docket No. 10445/L). Both of these patent applications arehereby incorporated by reference herein in their entirety for allpurposes.

FIELD OF THE INVENTION

The present invention relates generally to electronic (e.g.,semiconductor) device manufacturing and more particularly to apparatusand methods for conditioning a polishing pad.

BACKGROUND OF THE INVENTION

During conventional substrate processing, layers of material are formedon top of each other. Such layers may have surface undulations. As aresult, layers being formed may be deformed by a previously formedlayer. To reduce this effect, conventional semiconductor processes mayemploy a polishing process such as chemical mechanical polishing (CMP)or another suitable method. Such methods may employ a polishing pad toremove a portion of the layer so as to reduce the undulations.

The polishing process may employ, in addition to the polishing pad, amixture of abrasive particles and fluid (e.g., slurry). The abrasiveparticles and the material being removed from the layer may becomeembedded in the polishing pad. Such embedded material may dislodge fromthe polishing pad and scratch the wafer. To remove such undesirablematerial, a conditioning disk may be employed. The conditioning disk mayrotate while pressing the polishing pad with a force. However, theconditioning disk may apply a force and rotate at a speed that may notbe controlled or well known. Thus, such a conditioning disk may notoptimally remove a portion of the embedded material, thereby reducingthe useful life of the polishing pad. Accordingly, there is a need tocontrol the force and rotation of the conditioner pad.

SUMMARY OF THE INVENTION

In a first aspect of the invention, an apparatus for conditioning apolishing pad comprises a base, an arm pivotally coupled to the base andadapted to support a conditioning disk, and an actuator coupled to thebase and the arm. The actuator is adapted to cause the arm to press theconditioning disk against the polishing pad with a linearly variableamount of force.

In a second aspect of the invention, a method for conditioning apolishing pad is provided that includes producing a first force with anactuator, and scaling the first force by a linearly variable amount to asecond force that is applied to a polishing pad by a conditioning disk.

In a third aspect of the invention, an apparatus for conditioning apolishing pad comprises a base, an arm pivotally coupled to the base andadapted to support a conditioning disk, an actuator coupled to the baseand the arm, and adapted to cause the arm to press the conditioning diskagainst the polishing pad, and a sensor adapted to generate a signalindicative of an amount of force applied to a polishing pad by theconditioning disk.

In a fourth aspect of the invention, a method for conditioning apolishing pad is provided that includes applying a force to a polishingpad using a conditioning disk, measuring the force with a sensor, andgenerating a signal indicative of the force with the sensor.

In a fifth aspect of the invention, an apparatus for conditioning apolishing pad comprises an arm adapted to support a conditioning disk,and a drive mechanism coupled between the arm and the conditioning disk.The drive mechanism is adapted to directly rotate the conditioning diskrelative to the arm.

In a sixth aspect of the invention, a method for conditioning apolishing pad includes providing a direct drive mechanism having arotary motion, and coupling the rotary motion directly to a conditioningdisk such that the conditioning disk rotates.

In a seventh aspect of the invention, an apparatus for conditioning apolishing pad comprises an arm adapted to support a conditioning disk, adrive mechanism coupled to the arm, and a flexible coupling between thedrive mechanism and the conditioning disk adapted to allow theconditioning disk to tilt while transmitting rotary motion from thedrive mechanism to the conditioning disk.

In an eighth aspect of the invention, a method for conditioning apolishing pad includes providing a drive mechanism having a rotarymotion, and transmitting the rotary motion to a conditioning disk via aflexible coupling that allows the conditioning disk to tilt whilerotating the conditioning disk.

Other features and aspects of the present invention will become morefully apparent from the following detailed description, the appendedclaims and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic drawing of an example of a leverage arm designapparatus for conditioning a surface of a polishing pad according tosome embodiments of the present invention.

FIG. 2 is a schematic view depicting an example of a leverage arm designthat employs a leverage arm ratio to relate the forces applied to thearm in accordance with some embodiments of the present invention.

FIGS. 3A and 3B are schematic views depicting a conditioning diskcoupled to an example of a leverage arm design via a flexible rotatablemember in accordance with some embodiments of the present invention.

FIG. 4 is a perspective view of an example pad conditioner apparatushaving an applied leverage arm design in accordance with someembodiments of the present invention.

FIG. 5 is a detailed perspective view depicting a portion of an examplepad conditioner apparatus in accordance with some embodiments of thepresent invention.

FIG. 6 is a detailed perspective view of a portion of an example padconditioner apparatus including an applied leverage arm design inaccordance with some embodiments of the present invention.

FIG. 7 is a schematic view of an example conditioner feedback apparatusin accordance with some embodiments of the present invention.

FIG. 8 is a detailed perspective view depicting an example padconditioner feedback apparatus that employs a force transducer inaccordance with some embodiments of the present invention.

FIG. 9 is a schematic view of an example driven conditioning apparatusin accordance with some embodiments of the present invention.

FIG. 10 is a detailed perspective view of a motor coupled to a rotatableconditioning disk and an arm in accordance with some embodiments of thepresent invention.

DETAILED DESCRIPTION OF THE DRAWINGS

The present invention provides improved apparatus and methods forconditioning a polishing pad. More specifically, the present inventionprovides an apparatus and methods for controlling a conditioning diskwhile it is pressing on a polishing pad. The present invention includesa polishing pad conditioner. The polishing pad conditioner may includean arm, a base, a load cell, a direct drive motor and a gimbal. Thepolishing pad conditioner may be coupled to a conditioning disk.

In an embodiment, the polishing pad conditioner includes a leverage armdesign. In the leverage arm design, the arm may be pivotally coupled tothe base. The actuator and conditioning disk may be coupled such thatthe conditioning disk is further from the pivot than the actuator. Theactuator may be coupled to the arm and adapted to apply a force betweenthe arm and base. Since the conditioning disk is further away from thepivot than the actuator, the arm effectively reduces the actuator forceto a smaller conditioning disk force in proportion to the length of thearm. Thus, the leverage arm design may reduce the actuator force, andany fluctuations in the actuator force, to a smaller conditioning diskforce. Since an increase in the actuator force may not have acorresponding increase in fluctuations, the leverage arm designeffectively increases the conditioning disk force to variation ratio.Accordingly, there is an improvement in the control of the conditioningdisk force, thereby improving control over the removal of the embeddedmaterial. In this manner, the useful life of the polishing pad may beextended.

The polishing pad conditioner may also include a force sensor. The forcesensor may measure and provide a signal indicative of the conditioningdisk force. In an embodiment, the sensor may be coupled between theactuator and base. In an alternative embodiment, the sensor may becoupled between the actuator and the arm. The force sensor may measurethe actuator force. As described above, the actuator force is linearlyrelated to the sensor force in proportion to the length of the arm.Thus, the sensor may provide a signal indicative of the conditioningdisk force even though it may be coupled to the actuator. The signal maybe fed to a controller that is adapted to control the force applied bythe actuator. By employing such a sensor, a desired quantity ofconditioning disk force may be applied by the controller by applying acorresponding quantity of actuator force. Thereby, the force sensor mayallow for more optimal control of the removal of the embedded material.In this manner, the useful life of the polishing pad may be extended.

The invention also provides a direct drive motor to rotate theconditioning disk. Conventional motors, not having a direct drive, mayrequire a transmission system to rotate the conditioning disk. Suchtransmission systems may have piece parts with mechanical tolerancesthat cause a slack between the conventional motor and the rotation ofthe conditioning disk. The slack in the transmission system may causeundesirable variations (e.g., backlash, vibrations, and/or the like) inthe rotation of the conditioning disk. By employing a direct drivemotor, the transmission system and the associated slack, may beeliminated. Thus, undesirable variation in the conditioning diskrotation may be reduced or eliminated, thereby allowing for greatercontrol over the rotation of the conditioning disk. In this manner, theuseful life of the polishing pad may also be extended. However, in someembodiments, a direct drive motor coupled to a planetary gear mayprovide a suitable degree of control over the rotation of theconditioning disk.

The invention also provides a gimbal. The gimbal may be a flexiblematerial such as plastic. The gimbal may be employed to transmitrotation from the direct drive motor to the conditioning disk. Thegimbal may be flexible so as to allow tilting while transmitting therotation. Concurrently, the conditioning disk may apply a pressure tothe polishing pad. The flexibility to tilt while applying the pressureallows the pressure to be more uniform. This may allow more uniformremoval of the embedded material. In this manner, the useful life of thepolishing pad may be further extended.

FIG. 1 is a schematic drawing of a leverage arm design apparatus forconditioning a surface of a polishing pad by pressing and rotating aconditioning disk on the surface of the polishing pad in accordance withan embodiment of the present invention. The leverage arm designapparatus 100 may include a base 102 and an arm 104. The base 102 may becoupled to the arm 104 via a pivot 106. The apparatus may also includean actuator 108 coupled to the base 102 and the arm 104. A conditioningdisk 110 may be coupled to the arm 104 via a rotatable member 112. Therotatable member 112 may be rotatively coupled to the arm 104.

The base 102 may be stationary with respect to the arm 104. For example,the base 102 may be attached to semiconductor equipment such as a CMP orother suitable equipment. Alternatively, the base 102 may be coupled tofacilities supporting semiconductor manufacturing such as a wall,building structure and/or the like. As another alternative, the base 102may rotate about a vertical axis. A motor not shown may enable the base102 to rotate about the vertical axis. The motor may connect the base102 to the semiconductor equipment, the other equipment, the facilitiessupporting semiconductor manufacturing, etc. The motor may be a directdrive motor or other suitable motor. In addition, the motor may beconnected to the base 102 via a suitable transmission mechanism, such asa lead screw or zero backlash harmonic gear.

The arm 104 may freely rotate about the pivot 106 in all directions. Inan alternative embodiment, the arm 104 may be free to rotate about thepivot 106 only in the plane formed by the arm 104 and the actuator 108.In either embodiment, the actuator 108 may apply a force to the base 102and the arm 104 so as to rotate the arm 104, relative to the base 102,about the pivot 106. In addition to applying the force, the actuator 108may expand or contract axially, thereby allowing for rotation of the arm104 relative to the base 102 while still being coupled to the base 102and the arm 104. More than one actuator 108 may be employed althoughonly one actuator is depicted in FIG. 1.

The conditioning disk 110 may rotate relative to the arm 104. Therotation of the conditioning disk 110 may be imparted to theconditioning disk 110 by the rotatable member 112. The rotation of theconditioning disk 110 may be in either direction and may be employed tocondition a surface of a polishing pad. In addition, the rotation of therotatable member 112 may be approximately the same as the rotation ofthe conditioning disk 110 although other suitable rotation ratios may beemployed. The rotation of the conditioning disk 110 may be employedalong with a pressure to condition the polishing pad.

To create the pressure, the arm 104 may be employed to press theconditioning disk 110 against the polishing pad. The force employed bythe arm 104 to press the conditioning disk 110 against the polishing padmay be applied to the arm by the actuator 108 and/or other sources(e.g., weight of the arm and conditioning disk, friction and/or thelike). The forces applied to the arm may form torques about the pivot106. The forces applied to the arm may also include a polishing padforce. The polishing pad force is applied to the arm by a polishing padpressure 114. The polishing pad pressure 114 may be applied by thepolishing pad to the conditioning disk 110 when the arm presses theconditioning disk 110 to the polishing pad.

Because the arm 104 may rotate about the pivot 106, the polishing padpressure 114 may be controlled by the actuator 108. The polishing padforce imparted on the arm by the polishing pad pressure 114 may beproportional to an actuator force applied by the actuator 108 to the arm104. The polishing pad force 202 (see FIG. 2) is described in moredetail below and may be in the range of about 0 to about 14 lbs. Theactuator force and the polishing pad force may be linearly proportional.The actuator force and the polishing pad force may be proportional tothe ratio between the distance between the pivot 106 and the actuatorforce and distance between the pivot 106 and the polishing pad force, asexplained below with reference to FIG. 2.

FIG. 2 is a schematic view depicting a leverage arm design that employsa leverage arm ratio to relate the forces applied to the arm inaccordance with an embodiment of the present invention. As discussedabove with reference to FIG. 1 and depicted in FIG. 2, a polishing padforce 202, an actuator force 204 and an arm weight 206 may be applied tothe arm 104. As discussed above in reference to FIG. 1, the arm 104 maybe pivotally coupled to the pivot 106 as depicted in FIG. 2. Theactuator force 204 may be located at an actuator force distance 208 fromthe pivot 106. The polishing pad force 202 may be located at a polishingpad force distance 210 from the pivot 106. The location of the center ofgravity 212 of the arm 104 may be a weight distance 214 from the pivot106. The weight 206 of the arm 104 may vary as a function of, interalia, the material and gauge of material used to construct it. The armweight 206 may approximately traverse the center of gravity 212 of thearm 104. Due to the distances, the forces applied to the arm mayeffectively create torques about the pivot 106.

Because the arm 104 may rotate about the pivot 106, the polishing padforce 202, the actuator force 204 and the arm weight 206 may formtorques about the pivot 106. An actuator torque 214 due to the actuatorforce 204 may be approximately equal to the actuator force 204multiplied by an actuator force distance 208. A polishing pad torque 216may be approximately equal to the polishing pad force 202 multiplied bythe polishing pad force distance 210. A weight torque 218 may beapproximately equal to the arm weight 206 multiplied by the arm weightdistance 214.

The arm weight 206 may pull the arm 104 in a downward direction (thedirection of the force of gravity) while the polishing pad force 202presses approximately upward on the arm 104. The actuator force 204 maybe in the approximately upward or approximately downward directionalthough it is depicted in the approximately upward direction in FIG. 2.Thus, to reduce the polishing pad force 202, the actuator force 204 maybe applied in the approximately upward direction. To increase thepolishing pad force 202 the actuator force 204 may be applied in theapproximately downward direction. The relationship between a quantity ofactuator force 204 and a quantity of the polishing pad force 202 may beproportional to a leverage ratio of the distances of the forces.

The leverage ratio of the leverage arm design may be a ratio of thedistance between two or more forces being applied to the arm 104.Specifically, the polishing pad force 202 may be proportional to theleverage ratio of the polishing pad force distance 210 to the actuatorforce distance 208. Thus, if the actuator force distance 208 is smallerthan the polishing pad force distance 210, the polishing pad force 202may be smaller than the actuator force 204. For example, the leverageratio of the polishing pad force distance 210 to actuator force distance208 may be about 10 to about 1. In this example, and when the arm 104 isstationary, the actuator force 204 may be approximately ten times largerthan the polishing pad force 202 although the actuator force 204 may begreater or smaller depending on the arm weight 206. Thus, the leveragearm design may reduce the actuator force 204 to a polishing pad force202.

Reducing the actuator force 204 to a smaller polishing pad force 202with the leverage arm design may be desired. An increase in the actuatorforce 204 may not have a corresponding increase in variation in theactuator force. Also, an increase in the actuator force 204 may notincrease variations of other forces applied to the arm 104 near theactuator 108. By reducing the actuator force 204 to a smaller polishingpad force 202 using the leverage ratio, the actuator force 204 may beincreased to impart a desired polishing pad force 208. In this manner,variations associated with the actuator 108 and/or other forces appliedto the arm 104 may be reduced. Thus, the leverage ratio of the leveragearm design may improve the force to variation ratio, thereby improvingthe control over the polishing pad pressure.

In addition, the reduction in the actuator force 204 to the polishingpad force 202 may allow for greater selection in the actuator. Forexample, an actuator that applies a force range of about 5 lbs to about50 lbs may be employed in a leverage arm design apparatus 100 thatapplies a polishing pad force 202 of about 0.5 lbs to about 5 lbs. Someapplications of the leverage arm design apparatus 100 may preferablyemploy such force ranges. However, relatively inexpensive actuators ableto apply a force range of about 0.5 lbs to about 5 lbs may not beavailable or may be prohibitively expensive. Thus, the leverage armdesign may allow for a reduction in material costs of the leverage armdesign apparatus 100 and/or employment of the leverage arm designapparatus 100 in low down force applications.

FIGS. 3A and 3B are schematic drawings depicting the conditioning diskcoupled to the arm via a flexible rotatable member in accordance anembodiment of the present invention. The polishing pad conditionerapparatus 300 may employ a leverage arm design similar to the leveragearm design apparatus 100 described with reference to FIGS. 1-2. Thepolishing pad conditioner apparatus 300 depicted in FIG. 3 may includethe arm 104 coupled to the conditioning disk 110 via a flexiblerotatable member 302.

The flexible rotatable member 302 may be adapted to impart a rotation tothe conditioning disk 110 such that the conditioning disk 110 rotatesrelative to the arm 104. Further, the flexible rotatable member 302 mayalso be adapted to flex when a non-uniform polishing pad pressure 304 isapplied to the conditioning disk 110. The non-uniform polishing padpressure 304 may be due to a surface of the conditioning disk 110 and asurface of the polishing pad not being coplanar or other reasons. Thenon-uniform polishing pad pressure 304 may also be due to otherimperfections such as surface undulations of the polishing pad. Theconditioning disk 110 may tilt so as to allow the non-uniform polishingpad pressure 304 to change into a more uniform polishing pad pressure304′. The more uniform polishing pad pressure 304′ is not necessarilyperfectly uniform. A flexed flexible member 302′ may allow somenon-uniformity to be present in the more uniform polishing pad pressure304′.

The flexible rotatable member 302 may include one or more portions. Forexample, the flexible rotatable member 302 may include an approximatelyrigid shaft coupled to a flexible coupler (e.g., gimbal, rubber, etc.).The flexible coupler may be coupled between the shaft and theconditioning disk 110. Conversely, the flexible coupler may be coupledbetween the shaft and the arm. The flexible rotatable member 302 mayalso be a single flexible member that is able to flex when a non-uniformpolishing pad pressure 304 is applied to the conditioning disk 110.

FIG. 4 is a perspective drawing of a pad conditioner apparatus having anapplied leverage arm design in accordance with an embodiment of thepresent invention. The pad conditioner apparatus 400 may have acylindrical base 402. The cylindrical base 402 may be pivotally coupledto a tubular arm 404 via a housed pivot 406. A pneumatic actuator 408may be coupled to the cylindrical base 402 and the tubular arm 404. Thepneumatic actuator 408 may be coupled to the tubular arm 404 via anactuator housing 410. The tubular arm 404 may be coupled to a rotatableconditioning disk 412 via a rotatively driven member 414. The padconditioner apparatus 400 may also include a rounded actuator cover 416coupled to the actuator housing 410. In some embodiments of the presentinvention, a pad conditioner apparatus 400 and associated components maybe made from various different materials including aluminum, stainlesssteel, carbon steel, polyvinyl chloride (PVC), polyethyleneterephthalate (PET), etc.

In operation, the pad conditioner apparatus 400 may employ a leveragearm design that may be similar to the leverage arm design apparatus 100employing the leverage ratio described with reference to FIGS. 1 and 2.The pneumatic actuator 408 may apply a pneumatic actuator force to theactuator housing 410. A weight of the tubular arm 404 and/or thepneumatic actuator force may be employed to press the rotatableconditioning disk 412 into the polishing pad with a rotatableconditioning disk force. The pneumatic actuator force may be linearlyproportional to a polishing pad force due to the applied leverage armdesign. Further, the rotatable conditioning disk 412 may rotate whilepressed into the polishing pad.

In an embodiment, the tubular arm 404 may have a portion without weldsand/or seals. By employing such a portion, the tubular arm 404 mayprovide an improved seal to shield an internal region of the tubular arm404 from contaminants such as slurry and/or other matter. Shielding theinternal region of the tubular arm 404 may be desired so as to ensurethat components such as sensors, motors and/or the like are notundesirably contaminated. In addition, the rounded top surface of thetubular arm 404 may employ gravity to remove a portion of contaminantsthat may be present on a surface of the tubular arm 404. Suchcontamination may undesirably affect the performance of the componentsemployed by the pad conditioner apparatus 400.

To further address possible contamination, the pad conditioner apparatus400 may also include a rounded actuator cover 416. The rounded actuatorcover 416 may allow portions of the contamination on a surface of therounded actuator cover 416 to slide off the surface. Thus, thecontamination may not accumulate on the surface of the rounded actuatorcover 416. This may be desired to reduce the possibility ofcontamination of the components of the pad conditioner apparatus 400.

In some embodiments, the rotatable conditioning disk 412 may be allowedto tilt. The rotatively driven member 414 may be coupled to a flexiblemechanism similar to the flexible rotatable member 302 described withreference to FIG. 3. An embodiment that allows the conditioning disk 412to tilt is described in more detail below with reference to FIG. 5.

FIG. 5 is a detailed perspective drawing depicting a portion, includingthe rotatable conditioning disk, of the pad conditioner apparatus inaccordance with an embodiment of the present invention. The padconditioner apparatus 400 may include a rotatively driven member 414 asdescribed above with reference to FIG. 4. The rotatively driven member414 may be coupled to a rotatable conditioning disk 412 via a gimbal502.

Still with reference to FIG. 5, the rotatively driven member 414 mayimpart a rotation to the rotatable conditioning disk 412 via the gimbal502. The gimbal 502 may be adapted to move or flex so as to allow therotatable conditioning disk 412 to tilt when a non-uniform pressure isapplied to a surface of the rotatable conditioning disk 412. In someembodiments, in place of a gimbal 502, a flexible sheet or disk ofmaterial may be used. The flexible sheet or disk may include a centraltop attachment point that may be coupled to the rotatively driven member414 and a lower peripheral surface that may be coupled to the rotatableconditioning disk 412. In alternative embodiments, the flexible sheet ordisk may be inverted and attached to the rotatable conditioning disk 412at the center and to the rotatively driven member 414 at the periphery.Thus, the radial flexibility of the flexible sheet or disk may allow therotatable conditioning disk 412 to tilt relative to the rotativelydriven member 414. Therefore, similar to the polishing pad conditionerapparatus 300 described with reference to FIG. 3, the pressure appliedto a surface of the rotatable conditioning disk 412 may become moreuniform.

In some embodiments, the gimbal 502 may be replaced by alternative meansof flexing. For example, the gimbal 502 may be a flexible joint coupledto the rotatively driven member 414 and the rotatable conditioning disk412. In alternative embodiments, the flexible portion, similar to theflexible rotatable member 302 described in reference to FIG. 3, may becoupled to the tubular arm 404 and the rotatively driven member 414.

Returning to FIG. 4, the pad conditioner apparatus 400 may also includethe pneumatic actuator 408. The pneumatic actuator 408 may include ametal seal pneumatic cylinder coupled to a rod. The rod may be coupledto the tubular arm 404. Although the pneumatic actuator 408 may beactuated by compressed air, any suitable means may be employed. Forexample, the pneumatic actuator 408 may be replaced by a hydraulicactuator motivated by hydraulic pressure. Alternatively, the pneumaticactuator 408 may be a stepper motor motivated by electrical power.

The rod may apply the pneumatic actuator force to the arm such that thepneumatic actuator force is linearly related to any displacement of therod. As discussed above, the pneumatic actuator force may be employed toapply a rotatable conditioning disk force to the polishing pad. Thelinearly proportional pneumatic actuator force may be desired to ensurea more controllable rotatable conditioning disk force. For example, ifthe pneumatic actuator force is linearly proportional to thedisplacement of the rod, then it may be possible to correlate therotatable conditioning disk force with the displacement of the rod. Themanner in which the pneumatic actuator 408 may apply a force and becoupled to the tubular arm 404 and to the cylindrical base 402 isdescribed in more detail below with reference to FIG. 6.

FIG. 6 is a detailed perspective drawing of a portion of the padconditioner apparatus having an applied leverage arm design inaccordance with an embodiment of the present invention. The padconditioner apparatus 400 may include a base extension 602. The baseextension 602 may be coupled to the cylindrical base 402. A base rod 604may be coupled to the base extension 602 and the pneumatic actuator 408.An arm rod 606 may be coupled to the actuator housing 410. A pivotmember 608 may be coupled to the housed pivot 406 and the actuatorhousing 410.

In operation, the pneumatic actuator 408 may apply a force to the baseextension 602 via the base rod 604 and the actuator housing 410 via thearm rod 606. The force may cause the tubular arm 404, actuator housing410 and pivot member 608 to pivot about the housed pivot 406. Therebythe force may be employed to apply a rotatable conditioning disk forceto the polishing pad as described with reference to FIG. 4.

FIG. 7 is a schematic view of a conditioner feedback apparatus employedto press a conditioning disk into a polishing pad with an arm and anactuator, and provide a signal indicative of the force applied to thepolishing pad, in accordance with an embodiment of the presentinvention. A conditioner feedback apparatus 700 may be similar to theleverage arm design apparatus 100 described with reference to FIG. 1.The polishing pad conditioner feedback apparatus 700 may have a feedbackactuator 702 coupled to the arm 104 via a force transducer 704. Thefeedback actuator 702 may also be coupled to the base 102.

In a manner similar to the leverage arm design apparatus 100, thefeedback actuator 702 may apply a force to the arm 104 via the forcetransducer 704. The force may be measured by the force transducer 704.The force transducer 704 may provide a signal to a controller 706indicative of the force applied to the arm 104 by the feedback actuator702. The signal indicative of the force applied to the arm 104 may beproportional to the force applied to the polishing pad by theconditioning disk 110 due to the leverage ratio as described withreference to FIGS. 1 and 2. The controller 706 may be coupled to thefeedback actuator 702 to send a control signal to the feedback actuator702 to adjust the force applied to the arm 104 in response to the signalfrom the force transducer 704.

In alternative embodiments, the force transducer 704 may be disposed inother suitable locations. For example, the force transducer 704 may bedisposed between the feedback actuator 702 and the base 102. In yetanother embodiment, the force transducer 704 may be coupled to theconditioning disk 110 so as to measure the polishing pad force directly.In such an embodiment, the leverage ratio may not be employed todetermine the polishing pad force.

FIG. 8 is a detailed perspective drawing depicting a pad conditionerfeedback apparatus employing a force transducer in accordance with anembodiment of the present invention. The pad conditioner feedbackapparatus 800 may be similar to the pad conditioner apparatus 400described with reference to FIGS. 4-6 and the conditioner feedbackapparatus 700 described with reference to FIG. 7. The pad conditionerfeedback apparatus 800 may include a transducer 802. The transducer 802may be physically coupled to the base rod 604 and the base extension 602and electrically coupled to a controller.

Similar to the pad conditioner apparatus 400 described with reference toFIG. 6, the pneumatic actuator 410 may apply a force to the baseextension 602. The transducer 802 may measure the force and provide asignal to a controller (not shown) indicative of the force. Thetransducer 802 may be, for example, a load cell strain gage manufacturedby Measurement Specialties, Inc. of Hampton, Va. or Honeywell Sensingand Control of Golden Valley, Minn. A range of the force that thetransducer may measure may be from about −150 lbs to about +150 lbs. Thecontroller may use the signal to adjust the amount of force beingapplied by the pneumatic actuator 410.

Still with reference to FIG. 8, similar to the conditioner feedbackapparatus 700 describe with reference to FIG. 7, the transducer 802 maybe disposed in different locations. For example, the transducer 802 maybe coupled to the arm rod 606. In such an embodiment, the transducer 802may be disposed between the pneumatic actuator 410 and the arm rod 606.Alternatively, the transducer 802 may be disposed between the arm rod606 and the actuator housing 410.

FIG. 9 is a schematic drawing of a driven conditioning apparatus havinga motor to rotate the conditioning disk in accordance with an embodimentof the present invention. The driven conditioning apparatus 900 may havea leverage design similar to embodiment 100. In addition, the drivenconditioning apparatus 900 may include a driving mechanism 902. Thedriving mechanism 902 may be rotatively coupled to the conditioning disk110 via the rotatable member 112. A weight of the driving mechanism 902may be combined with the arm weight 206 such that a combined weight 904may be formed. The combined weight 904 may be located at a combinedcenter of gravity 906.

The driving mechanism 902 may be adapted to rotate the conditioning disk110 via the rotatable member 112. The driving mechanism 902 may rotatethe conditioning disk 110 while the conditioning disk 110 is pressinginto a polishing pad. In some embodiments, a rotation frequency (e.g.,revolutions per minute (rpm)) of a portion of the driving mechanism 902may be approximately equal to a conditioning disk 110 rotationfrequency. In the same or alternative embodiments, the rotationfrequency of a portion of the driving mechanism 902 may be differentthan the conditioning disk 110 rotation frequency.

A weight of the driving mechanism 902 may be added to the arm weight206. For example, the weight of the driving mechanism 902 may be addedto the arm weight 206 to form an aggregate weight 904. The aggregateweight 904 may be different than the weight of the arm 104. In addition,the distance of the combined center of gravity 906 from the pivot 106may be different than the center of gravity 212. Thus, the leverageratio, discussed in detail with reference to FIG. 2, may be differentwhen the driving mechanism 902 is coupled to the distal end of the arm104. Specifically, the distance of the aggregate weight 904 from thepivot 106 may be greater than the weight distance 214 discussed withreference to FIG. 2. Consequently, the leverage ratio may be increasedwhen the aggregate weight 904 is further from the pivot than the centerof gravity 212.

The driving mechanism 902 may be a motor or another suitable drivingmechanism. For example, the driving mechanism 902 may be an electricalmotor. In alternative embodiments, the driving mechanism 902 may be apneumatically driven motor. In further alternative embodiments, thedriving mechanism may be a direct drive motor, which may be coupled to aplanetary gear.

FIG. 10 is a detailed perspective drawing of a motor coupled to therotatable conditioning disk and the tubular arm in accordance with anembodiment of the present invention. A motor 1002 may be coupled to thetubular arm 404 and the rotatively driven member 414. Similar to the padconditioner apparatus 400 discussed with reference to FIGS. 4 and 5, therotatively driven member 414 may be coupled to the rotatableconditioning disk 412 via the gimbal 502.

The motor 1002 may be a direct drive motor or another suitable motor. Inother embodiments, the motor 1002 may be coupled to a planetary gear.The motor 1002 may be directly coupled to the rotatively driven member414 so as to rotate the rotatable conditioning disk 412 at about thesame rotation frequency as a rotatable portion of the motor 1002. Inother embodiments, the motor 1002 may be coupled to the rotatableconditioning disk 412 such that the rotation frequency of the rotatableportion of the motor 1002 may be different than the rotation frequencyof the rotatable conditioning disk 412.

The foregoing description discloses only exemplary embodiments of theinvention. Modifications of the above disclosed apparatus and methodwhich fall within the scope of the invention will be readily apparent tothose of ordinary skill in the art. For instance, an actuator may bedisposed in other locations relative to the base. The actuator may becoupled to the arm and something other than the base so as to apply apolishing pad pressure.

Accordingly, while the present invention has been disclosed inconnection with exemplary embodiments thereof, it should be understoodthat other embodiments may fall within the spirit and scope of theinvention, as defined by the following claims.

1. An apparatus for conditioning a polishing pad comprising: a base; anarm pivotally coupled to the base and adapted to support a conditioningdisk; and an actuator coupled to the base and the arm, and adapted tocause the arm to press the conditioning disk against the polishing padwith a linearly variable amount of force.
 2. The apparatus of claim 1,wherein the actuator includes a sealed pneumatic cylinder coupled to arod.
 3. The apparatus of claim 1, wherein the conditioning disk iscoupled to the arm further from the pivot than the actuator is coupledto the arm.
 4. The apparatus of claim 3, wherein a ratio of a distanceof the conditioning disk to the pivot along the arm and a distance ofthe actuator to the pivot along the arm is at least approximately 10:1.5. The apparatus of claim 1, further comprising a force transducercoupled to the arm and the actuator and situated between the arm and theactuator, and adapted to measure a force applied to the arm by theactuator.
 6. The apparatus of claim 1, further comprising a furtheractuator coupled to the base and the arm, and adapted to cause the armto press the conditioning disk against the polishing pad with a linearlyvariable amount of force.
 7. A method for conditioning a polishing padcomprising: producing a first force with an actuator; scaling the firstforce by a linearly variable amount to a second force that is applied toa polishing pad by a conditioning disk.
 8. The method of claim 7 furthercomprising: pressing the conditioning disk into the polishing pad. 9.The method of claim 7 further comprising: providing a signal indicativeof the first force produced by the actuator to a controller; andadjusting the first force based on the signal.
 10. The method of claim 7further comprising: tilting the conditioning disk when a non-uniformpressure is applied to a surface of the conditioning disk.
 11. A methodfor conditioning a polishing pad comprising: providing a drive mechanismhaving a rotary motion; and transmitting the rotary motion to aconditioning disk via a flexible coupling that allows the conditioningdisk to tilt while rotating the conditioning disk.
 12. An apparatus forconditioning a polishing pad comprising: an arm adapted to support aconditioning disk; a drive mechanism coupled to the arm; and a flexiblecoupling between the drive mechanism and the conditioning disk adaptedto allow the conditioning disk to tilt while transmitting rotary motionfrom the drive mechanism to the conditioning disk.
 13. The apparatus ofclaim 12, wherein the flexible coupling includes a disk.
 14. Theapparatus of claim 13, wherein the disk is one piece.
 15. The apparatusof claim 13, wherein the disk is plastic.
 16. The apparatus of claim 13,wherein the drive mechanism is coupled to a center portion of the disk.17. The apparatus of claim 13, wherein the conditioning disk is coupledto an outer portion of the disk.
 18. The apparatus of claim 13, whereinthe drive mechanism is coupled to an outer portion of the disk.
 19. Theapparatus of claim 13, wherein the conditioning disk is coupled to acenter portion of the disk.
 20. The apparatus of claim 12, wherein theflexible coupling includes a shaft.